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    An Introduction to Thermal Analysis in Solid Structures



    The NAFEMS Education and Training Working Group wishes to commission a new book in the “WHY DO” series on Thermal FE analysis.


    This book should be aimed at a graduate level industrial user who is familiar with basic linear FE analysis, but is inexperienced in dvanced FE analysis, who wishes to start analysing thermal problems.


    The book should cover all modern aspects of FE thermal analysis in solid structures. The following topics are expected to be covered:

    • Heat transfer mechanisms; conduction, convection, radiation
    • Steady state and transient problems
    • Thermal boundary conditions, e.g. temperatures and heat transfer coefficients
    • Linear and non-linear thermal analysis
    • Thermal material properties
    • Thermal stresses (and associated structural properties and loading)
    • Sequential  and coupled thermal-stress analysis.


    The total cost is not expected to exceed £7,000.

    It is expected that the book will be completed within 12 months from NAFEMS approval.


    Potential authors should submit the following:

    • A brief description of the main topics to be covered
    • Chapter and section headings with an approximate number of pages per chapter
    • Timescale for completing the book
    • Cost
    • CVs of the authors (Maximum two pages per author).


    Applicants are advised to study existing NAFEMSpublications in this field before submitting a bid. The following NAFEMS publications are relevant in this field:

    • HT14,   Ransing, RS, Hardy, S J, and Gethin, D T, How To Undertake Finite Element Based Thermal Analysis, 1999.
    • P16, Cameron, A D, Casey, J A, and Simpson, G B,Benchmark Tests for Thermal Analysis (Summary Report), 1986.
    • P02,   Burrows, DJ, Benchmark Tests in Thermal Stress Analysis Using Finite Element Methods,1985.

    All proposal should be sent to NAFEMS at to arrive no later than 31st May 2014.

    Further details are available from the NAFEMS office or by contacting the Chairman of the ETWG