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Integrated Thermal Fluid Simulation Workflows for Electronic Cooling Applications

T​his is an extended abstract that was submitted to the NAFEMS Americas Conference 2024.NAFEMS Americas Conference 2024. The conference was held in Lousville, KY, on 9–11 July 2024.

Document Details

Referenceam24-ext-abs-38
AuthorMukutmoni. D
LanguageEnglish
AudiencesAnalyst
TypeExtended Abstract
Date 9th July 2024
OrganisationDassault Systèmes
RegionAmericas

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