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Combining Physical Test with Structural FEA to Develop Package-Specific Failure Models for Electronic Components

T​hese slides were presented at the NAFEMS Americas Conference 2024. The conference was held in Lousville, KY, on 9–11 July 2024.

Document Details

Referenceam24-pres-15
AuthorFerris. T
LanguageEnglish
AudiencesAnalyst
TypePresentation
Date 9th July 2024
OrganisationAnsys
RegionAmericas

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