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Themo-Mechanical Analysis of System Level Effects on Electronic Packages

T​hese slides were presented at the NAFEMS Americas Conference 2024. The conference was held in Lousville, KY, on 9–11 July 2024.

Document Details

Referenceam24-pres-47
AuthorPurushotaman. A
LanguageEnglish
AudiencesAnalyst
TypePresentation
Date 9th July 2024
OrganisationAnsys
RegionAmericas

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