NAFEMS Americas and Digital Engineering (DE) teamed up (once again) to present CAASE, the (now Virtual) Conference on Advancing Analysis & Simulation in Engineering, on June 16-18, 2020!

CAASE20 brought together the leading visionaries, developers, and practitioners of CAE-related technologies in an open forum, unlike any other, to share experiences, discuss relevant trends, discover common themes, and explore future issues, including:
-What is the future for engineering analysis and simulation?
-Where will it lead us in the next decade?
-How can designers and engineers realize its full potential?
What are the business, technological, and human enablers that will take past successful developments to new levels in the next ten years?

Resource Abstract

The value of a Dynamic Compact Thermal Models (DCTM) in electronics thermal design have been understood for a number of years through their ability to accelerate the design process. Explicit representation of all components with a detailed system level CFD (Computational Fluid Dynamics) analysis is not well suited for understanding the dynamic temperature response of a system. A transient CFD analysis can be prohibitively time consuming. Thermal RC networks have been used as a DCTM but are time consuming and require a trial-and-error approach to develop. In addition to the difficulties and limitations of the current approaches, the compact models generally don’t support parallel design processes such as Electro-Thermal or reliability predictions. Transient superposition is another method that has been used to accelerate the design process and is applicable to many system topologies without the need for fitting and testing multiple RC networks until the desired accuracy is achieved. Though transient superposition is an accurate approach it hasn’t been widely adopted by the thermal design community in part due to their boundary condition dependence and limited port-ability to other design flows. Reduced Order Modelling is an alternative approach to extracting a DCTM from a thermal simulation model. A BCI-ROM (Boundary Condition Independent Reduced Order Model) provides analysis speed, Boundary Condition Independence, and solution environment flexibility to facilitate parallel design processes that require temperature response as an input. The new approach to BCI-ROM development is an extension of the FANTASTIC method and is applicable to any arbitrary system topology for the thermal design of electronics. The process requires little expertise to develop and generates a BCI-ROM of user defined accuracy.

This presentation discusses the current approaches available for analyzing the temperature response of an electronic system and introduces a new method for BCI-ROM development. Examples shown will include a multi-chip module (MCM) and an IGBT subject to the UDDS: FTP-72 Drive Cycle for an Electric Vehicle