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Reducing of Vibrations of Wiring Boards in Products of Electronics

This paper on "Reducing of Vibrations of Wiring Boards in Products of Electronics" was presented at the NAFEMS World Congress on The Evolution of Product Simulation From Established Methods to Virtual Testing & Prototyping - 24-28 April 2001, The Grand Hotel, Lake Como, Italy.

Summary

The paper cites the results of the study of vibration protection of the functional boards by means of the damping elements of the attaching structures. The estimate of the value of "dry" friction of the damping element for effective protection is given. A method of attaching of the wiring boards which practically excludes their strains and ensures good vibration isolation in the wide range of driving frequencies has been found.

Document Details

ReferenceNWC01_80
AuthorRoyzman. V
LanguageEnglish
TypePaper
Date 24th April 2001
OrganisationTechnological University of Podillia
RegionGlobal

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