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Multi-Physics Modelling of High Density IC Encapsulation

This paper was presented at the 2013 NAFEMS World Congress in Salzburg, Austria which was held between the 9th and the 12th of June 2013.

Document Details

ReferenceNWC13_124
AuthorMeganathan. A
LanguageEnglish
TypePaper
Date 9th June 2013
OrganisationESI Group

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