This paper on "Multi-Physics Modelling for the Processing of Materials" was presented at the NAFEMS World Congress on Effective Engineering Analysis - 25-28 April 1999, Newport, Rhode Island, USA.

Abstract

Computational fluid dynamics (CFD) and Finite Element Analysis (FEA) codes are well-established at solving problems in fluid flow and solid mechanics respectively. But these techniques, used alone, have difficulty in accurately modelling a process where the physics is changing and/or where close coupling between the physics is occurring. This paper discusses the development of numerical techniques and associated software tools for solving such multi-physics type phenomena. Application of this type of modelling to the casting of metals and formation of solder joints in electronic packaging will be discussed.