This paper was produced for the 2019 NAFEMS World Congress in Quebec Canada

Resource Abstract

In this paper, we present the FEA based Multiphysics-circuit coupled modelling of a capacitive force sensor based on the electroactive polymer (EAP). Sensing action is based on the coupling of structural mechanics and electrostatics where electroactive polymer layer deforms with applied force and corresponding change in capacitance is captured via electrical circuits. The multi physics modelling approach presented here helps the designer to analyse & evaluate sensor performance and drive various design decisions at various stages of sensor development. The model presented can predict performance of sensor against varied sensing stimuli, various geometries, material parameters including the external circuit devices. Apart from these design parameters, environmental factors such as ambient temperature, humidity can affect the performance. The model will further be extended to account for these effects in future. COMSOL Multiphysics® is used to carry out these coupled simulations.